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Critics of CVP analysis claim that the assumptions underlying the analysis are almost certain to be violated in practice, thus severely limiting the practical value of the various techniques covered in this chapter. Moreover, say the critics, in the highly competitive environment in which many companies operate, the assumptions necessary for CVP analysis are even […]

Explain the similarity between Kirchhoff’s Current Law and Kirchhoff’s Voltage Law. 1. Explain the difference between ASICs and FPGAs. 2. Explain the interaction between users, application software, and hardware.

Explain the motivation for developing 3D integrated circuits. 1. Explain the timing constraints in an integrated circuit. 2. Considering a cylindrical resistor of radius 6.0 mm and length 2.0 cm, if the resistivity of the resistor material is 1.8 × 10−6 , calculate the resistance.

Full scan design is the only option in terms of scan chain insertion. In terms of controllability and observability provided by test point insertion, control points have no impact on observability, and observation points have no impact on controllability. SoC debug can be considered as pre-silicon validation, while SoC verification can be considered as post-silicon

Find the three currents (I1,I2,I3) and voltages (Vab,Vbc,Vbd ) in the circuit in Fig. 2.15. 1. Describe the typical PCB design flow. 2. Briefly summarize the features of a typical embedded system. 3. Explain the difference and similarity between software and firmware.

How do you consider that your SoC verification has a good coverage? Explain. Considering an IP core, the first silicon success rate for unverified IP core is 90 percent, whereas the first silicon success rate for verified IP core is 98 percent. (a) If a SoC consists of 10 such unverified IP cores, what is

List the types of common fault models. What are delay faults? What are the differences between transition delay faults (TDF) and path delay faults (PDF)? Explain ATPG. How can one measure the effectiveness of ATPG?

The yield of a manufacturing process is defined as the fraction of acceptable parts among all parts fabricated [5]. If the number of acceptable parts is 5000, and the number of total parts that are fabricated is 7000; calculate the yield. Defect level, also known as reject rate, is defined as the fraction of faulty

What are the differences between functional test and structural test? 1. (a) When doing manufacturing test for a design, consider the number of detected faults in the design is 81,506, the number of detectable faults in the design is 87,122, and the number of undetectable faults in the design is 103. What are the test

(a) If a scan-based design has 6400 scan flip-flops that can be constructed as 100 scan chains each with equal length, the number of test patterns is 5000, and testing clock cycle is 10 ns; what would be the test cycle and test time? (b) What are the main factors impacting manufacturing cost? How can